High-Precision Silicon Wafer Iron Ring for Industrial-Grade Dicing

JIS SUS420J Stainless Steel Construction – Corrosion-resistant and ultra-durable for long-term use in harsh environments. Precision-engineered 6-inch diameter ensures compatibility with standard wafer sizes.

Optimized for Semiconductor Manufacturing – Ideal for securing wafer slices during dicing, polishing, and handling processes. Reduces breakage and contamination risks in cleanroom settings.

Mirror-Finished Surface – Minimizes particle adhesion and ensures smooth wafer contact. Laser-etched markings prevent misalignment during high-speed processing.

Multi-Industry Application – Essential for semiconductor labs, LED production, and MEMS fabrication. Compatible with automatic dicing saws and manual handling systems.

Bulk Purchase Advantage – Factory-direct pricing for large-scale procurement. Custom packaging available to meet OEM and distributor requirements.