Premium Ag Lead Tin Solder Paste – High-Performance Bonding Solution
Superior conductivity with precise 60/40 tin-lead alloy ratio, ensuring strong, reliable connections for intricate electronics and circuitry. Low-temperature melting point (183°C) minimizes heat damage, ideal for delicate PCB repairs, DIY projects, and industrial manufacturing. Smooth, non-slumping paste texture enables effortless application via syringe or stencil, perfect for SMT assembly and precision soldering. Oxidation-resistant flux core eliminates pre-cleaning, reducing workflow steps while delivering bubble-free, glossy joints every time. Bulk packaging (100g/jar) optimized for cost-effective mass production—trusted by global wholesalers for unbeatable price-performance value.