Key Features of Electroless Copper Plating Chemical Q75 (Cas: 102-60-3)
High-purity N,N,N",N"-Tetrakis(2-hydroxypropyl)ethylenediamine ensures superior conductivity and adhesion in electroless copper plating. Ideal for PCB manufacturing, aerospace components, and automotive electronics due to its exceptional thermal stability. Precision-formulated for uniform deposition, reducing waste and improving efficiency in industrial-scale production. Compatible with multilayer and high-density interconnect applications. Globally sourced at unbeatable wholesale prices, backed by bulk-order discounts and fast international shipping. Trusted by OEMs and fabricators for consistent quality and performance.
Applications:
Printed circuit boards, EMI shielding, advanced metallization, and decorative finishes. Engineered for reliability in harsh environments.
Note:
Handle with proper PPE. Technical datasheet available upon request.