High-Quality WiFi OEM PCB Assembly for Mobile Phones
Premium FR4 material ensures durability and superior heat resistance for long-term performance. Multi-layer PCB design with precise SMT soldering guarantees stable signal transmission and high-speed connectivity. Advanced surface finish (ENIG) prevents oxidation and enhances solderability for reliable connections. Compact and lightweight, ideal for mobile phone motherboards, IoT devices, and smart electronics. Strict quality control (AOI & ICT testing) ensures zero defects and consistent performance. Customizable options available for bulk orders to meet specific project requirements. Direct factory pricing with no middlemen—wholesale discounts for large quantities. Fast global shipping from Shenzhen, the electronics manufacturing hub. Upgrade your production with professional-grade PCBA solutions.