High-Performance Two-Component Heat Conductive Potting Adhesive

Premium Thermal Management
– Advanced 1:1 and 10:1 AB adhesive formulations ensure superior heat dissipation for power modules, minimizing thermal resistance and enhancing device longevity.
Precision Material Science
– Engineered with high-purity thermally conductive fillers for optimal heat transfer, offering stable performance under extreme temperatures and mechanical stress.
Industrial-Grade Reliability
– Ideal for power electronics, automotive systems, and LED lighting, providing robust protection against moisture, vibration, and electrical interference.
Effortless Application
– Smooth curing with minimal shrinkage, ensuring seamless potting for complex geometries while maintaining electrical insulation properties.
Bulk Supply Advantage
– Direct factory pricing for wholesale quantities, guaranteeing the best value without compromising quality or performance.