Precision Temperature Control for Custom Chip Packaging
Engineered with high-precision Peltier modules and industrial-grade PID controllers, this system ensures accurate heating and cooling (±0.1°C stability) for semiconductor testing, chip encapsulation, and lab R&D.
Durable All-in-One Design
Features a corrosion-resistant stainless steel chamber and aerospace-grade thermal conductive paste for rapid heat transfer, supporting -40°C to 200°C ranges without external chillers.
Multi-Scenario Applications
Ideal for wafer-level packaging, automotive electronics reliability tests, and 5G component development. Compact footprint saves 30% bench space vs. traditional setups.
Batch-Optimized Pricing
Direct factory sourcing enables wholesale rates for bulk lab equipment purchases, backed by ISO 9001-certified manufacturing.
Smart Safety Integration
Auto-shutoff against overvoltage/overcurrent, with real-time LCD alerts. Modular design allows quick part replacement. Global logistics ready – MOQ 5 units for priority shipping.