Conductive Silver Paste DT1201 – Premium Low-Temperature Curing Solution for FPCs
Ultra-fine silver particles ensure superior conductivity (resistivity <5.0×10⁻⁵ Ω·cm) for stable signal transmission in flexible printed circuits. Low-temperature curing (80–120°C) prevents substrate warping, ideal for heat-sensitive FPC materials like polyimide films. High adhesion strength (≥1.0 kgf/cm) withstands repeated bending, perfect for wearables and foldable electronics. Smooth 10–15μm print thickness via screen/stencil printing, enabling precise circuit detailing in miniaturized designs. Solvent-free formulation reduces curing time to 15 mins while maintaining RoHS compliance for eco-conscious manufacturing. Trusted in automotive sensors, medical patches, and IoT devices – bulk orders ship globally at unmatched wholesale rates.