TBK R2201 Laser Disassembly Welding Machine with 4K Microscope & Thermal Imaging
Precision-engineered for professional-grade phone motherboard and chip repair, featuring ultra-fine laser control for non-destructive disassembly. Integrated 4K microscope delivers crystal-clear magnification for micro-soldering accuracy. Real-time thermal imaging diagnoses overheating components instantly. High-grade aluminum alloy frame ensures durability, while ergonomic design reduces operator fatigue during prolonged use. Compatible with BGA, CPU, and GPU repairs, ideal for electronics workshops and advanced DIY enthusiasts. Global wholesale pricing guarantees unbeatable value for bulk orders. Trusted by technicians worldwide for reliability and performance. Upgrade your repair toolkit with industry-leading technology.