Precision 6-Inch Silicon Wafer Iron Ring – JIS SUS420J Dicing Frame for Industrial Excellence

High-Grade SUS420J Stainless Steel
Crafted from corrosion-resistant JIS SUS420J steel, ensuring durability and long-term performance in harsh environments. Ideal for semiconductor handling and precision dicing applications.
Ultra-Flat Surface for Secure Wafer Mounting
Engineered with a flawless 6-inch diameter flatness (±0.05mm) to prevent wafer slippage during cutting or grinding processes. Essential for cleanroom and microfabrication labs.
Reinforced Edge Design for Stability
Features a laser-welded hoop structure with reinforced edges to withstand high tension during dicing, minimizing vibration for crack-free wafer processing.
Multi-Industry Compatibility
Perfect for semiconductor manufacturing, optical device production, and MEMS research. Compatible with automatic dicing saws and manual alignment systems.
Cost-Efficient Bulk Supply
Direct global wholesale pricing – no middlemen. Stock up for large-scale production without compromising quality or budget.
Ready for High-Precision Demands
Pre-packaged with anti-scratch coating to ensure out-of-the-box reliability for your next-gen electronics fabrication.