High-Purity 2-Hydroxyethyl Methacrylate Phosphate (HEMAP) for Precision UV Curing

Ultra-Reactive Monomer
– Advanced phosphate-modified HEMAP ensures rapid UV polymerization, ideal for high-efficiency solder mask formulations requiring exceptional adhesion and chemical resistance.
Engineered for Electronics
– Specially formulated for PCB solder masks, delivering superior heat tolerance (up to 280°C) and moisture barrier properties to protect circuits in harsh environments.
Low-Irritation & Eco-Compliant
– Purified to >99% with minimal residual solvents, meeting REACH and RoHS standards for safe handling in industrial UV coating applications.
Optimized Viscosity Control
– Precisely balanced molecular weight enables seamless blending with acrylate resins, ensuring bubble-free coatings for microelectronics and optical lenses.
Bulk Industrial Supply
– Direct-from-factory pricing for 25kg drums or custom batches, backed by ISO-certified production and global logistics support for wholesale buyers.
Dual-Cure Flexibility
– Compatible with both UV and thermal curing systems, expanding utility to automotive coatings, 3D printing resins, and dental composites.