High-Performance Silicone Potting Adhesive for Automotive & Semiconductor Applications

Premium two-component formula ensures superior thermal stability (-50°C to +200°C) and vibration resistance, ideal for ECU/IGBT module protection.

Industrial-grade silicone material features ultra-low shrinkage (<0.1%) and excellent dielectric strength (15kV/mm) for sensitive electronics encapsulation.

Precision-mixed 1:1 ratio guarantees bubble-free curing with self-leveling viscosity (4500cps) for seamless component coverage.

Certified waterproof (IP68) and chemical-resistant, perfect for automotive sensors, EV battery systems, and power semiconductor packaging.

Fast-curing option available (30min @120°C) for high-volume production lines without compromising elasticity (Shore A 35).

FDA-compliant non-corrosive formula protects delicate circuitry from moisture, dust, and thermal cycling stress.

Bulk packaging options (50kg drums) with wholesale pricing for OEM manufacturers and industrial suppliers.