High-Purity Low Melt Point Alloy - 58°C Lead Tin Bismuth Indium Blend
Precision-formulated alloy with optimal 58°C melting point, ideal for delicate soldering, electronics repair, and thermal fuse applications. Contains premium-grade lead, tin, bismuth, and indium for superior flow and adhesion.
Ultra-Low Temperature Performance
Perfect for heat-sensitive components, DIY crafting, and jewelry soldering—prevents damage to substrates. Bismuth-enriched formula ensures smooth finishes without brittleness.
Industrial-Grade Reliability
Used in circuit board rework, medical device assembly, and aerospace prototyping. Consistent viscosity and minimal slag residue enhance work efficiency.
Bulk Purchase Advantage
Direct factory pricing for wholesale buyers—customizable ingot sizes (1kg/5kg/25kg). Ships globally with certified material composition reports.
Safe & Versatile
RoHS-compliant options available. Essential for hobbyists, manufacturers, and labs requiring low-energy joining solutions.