Premium Low-Temperature Curing Conductive Silver Paste for FPC
Ultra-fast drying conductive silver paste formulated for flexible printed circuits (FPC), curing efficiently at low temperatures to prevent substrate damage. High-purity nano-silver particles ensure superior conductivity (≤5mΩ/sq) and adhesion strength, ideal for delicate electronics. Precision-engineered for smooth screen printing, delivering uniform thickness (15-25μm) with minimal resistance variation. Compatible with PET, PI, and other polymer films, perfect for wearable tech, RFID tags, and flexible sensors. Optimized for mass production—high thermal stability (up to 200°C) and oxidation resistance guarantee long-term reliability. Bulk pricing available for industrial-scale orders, ensuring cost efficiency without compromising performance.
Global wholesale leader—lowest price guaranteed, direct factory supply.