High-precision flux solder paste with Sn63/Pb37 alloy composition ensures superior wetting and bonding for flawless PCB repairs.

Premium lead-based formula delivers ultra-low melting point (183°C) and rapid flow characteristics for efficient mobile phone component rework.

Medical-grade resin core eliminates oxidation and prevents bridging during delicate SMD reballing operations.

Thixotropic texture maintains perfect consistency for both manual soldering irons and automated dispensing systems.

ESD-safe packaging preserves flux activity for extended shelf life in professional repair workshops.

Ideal for BGA chip replacement, USB port repairs, and micro-soldering on high-density smartphone motherboards.

Factory-sealed 10cc syringe allows controlled application without waste for precision electronics restoration.

Certified RoHS-compliant with 0.8mm particle size for clog-free performance in micro-pipette applications.

Trusted by mobile repair technicians worldwide for reliable cold joint prevention and shiny solder joints.