Precision-Cut Diamond Blade for Glass & Quartz
Ultra-thin diamond grit coating ensures razor-sharp, durable cuts with minimal material loss. High-grade metal core enhances stability for high-speed dicing. Electroplated bonding technology prevents segment wear, extending lifespan. Ideal for delicate glasswork, quartz substrates, and semiconductor wafer processing. Custom OEM specifications available for industrial-scale precision cutting. Bulk pricing optimized for manufacturers and lab suppliers. Heat-resistant design reduces chipping, delivering smooth edges on brittle materials. Compatible with most standard dicing saws. Global wholesale sourcing with factory-direct quality at unbeatable volume discounts.