High-Purity Solder Flux Paste
Premium rosin-based formula ensures optimal conductivity and corrosion resistance, ideal for precision PCB repairs and delicate mobile phone component soldering.
Non-Corrosive & Low Residue
Engineered with activated rosin and deionized solvents, leaves minimal residue after rework to prevent short circuits in high-density electronics like LCD flex cables.
Precision Applicator Design
Needle-tip syringe allows millimeter-level accuracy when applying to micro solder joints under phone screens or BGA chips.
Multi-Platform Compatibility
Proven effective on iPhone digitizer connectors, Android touchscreen ribbons, and tablet display ICs. Works with lead-free/tin-lead solder alloys.
Industrial-Grade Thermal Stability
Maintains viscosity from -40°C to 300°C, preventing flux evaporation during hot-air reballing operations.
ESD-Safe Packaging
Antistatic aluminum foil bladder protects flux integrity during shipping and storage.
Bulk-Optimized for Repair Shops
50ml professional volume reduces unit cost for high-frequency screen replacement businesses.
No-Clean Formula
Self-eliminating residues evaporate at 150°C, saving 70% post-soldering cleaning time versus conventional fluxes.
Certified Safe
REACH/RoHS compliant with MSDS documentation for international customs clearance.