Advanced Liquid Metal Cooling for Chips & Systems

Ultra-High Thermal Conductivity
– Engineered with precision-grade liquid metal alloy for superior heat dissipation, outperforming traditional thermal pastes by 300%. Ideal for high-performance CPUs, GPUs, and compact electronics.
Non-Corrosive & Long-Lasting
– Specially formulated to prevent oxidation and leakage, ensuring stable cooling efficiency even under extreme overclocking or 24/7 server loads.
Easy Application & Full Coverage
– Low viscosity design allows seamless spreading on uneven surfaces, perfect for intricate chip architectures like BGA or multi-die processors.
Scientific & Industrial-Grade
– Trusted by R&D labs and data centers for thermal management in AI servers, 5G基站, and aerospace hardware.
Genuine & Authoritative
– Directly sourced from Shanghai Science and Technology Publishing House, with technical insights by Liu Jing. Bulk orders available at wholesale pricing.
Global Wholesale Advantage
– Largest品类 inventory with unbeatable volume discounts. Ships worldwide.