Premium electroplated diamond dicing blade with hub for precision cutting and slotting applications. High-grade industrial diamond particles bonded with nickel plating ensure superior wear resistance and extended blade life. Precision-engineered hub design guarantees stable rotation and vibration-free operation during high-speed cutting. Ideal for semiconductor wafer dicing, ceramic substrate processing, glass cutting, and brittle material machining. Ultra-thin 0.1mm blade thickness enables clean cuts with minimal material loss. Professional-grade construction delivers consistent performance for laboratory, electronics manufacturing, and industrial applications. Optimized diamond concentration provides faster cutting speed while maintaining exceptional edge quality. Rigorous quality control ensures each blade meets exacting standards for dimensional accuracy and cutting performance.