Premium 3D Stencil for BGA Reballing & Chip Repair
High-precision laser-cut stainless steel stencil ensures flawless solder ball alignment for BGA rework. Compatible with MSM 32-bit ARM chips and universal iPhone/Android motherboard repairs. Ultra-thin 0.1mm thickness guarantees precise solder paste application. Anti-static coating prevents component damage during reflow. Ideal for professional microsoldering, factory-level repairs, and DIY electronics restoration. Durable oxidation-resistant design supports repeated high-temperature use. Global wholesale pricing with bulk discounts for repair shops and tech distributors. Ships worldwide from certified electronics suppliers.