High-Precision BGA Rework Solution
Ultra-stable temperature control with PID tech ensures flawless desoldering/soldering, preventing PCB damage. Industrial-grade ceramic heating elements deliver rapid, even heat distribution up to 500°C.
All-Metal Construction & Smart Sensors
Aircraft-grade aluminum body with anti-static coating resists corrosion. Built-in infrared sensors auto-detect chip placement, eliminating manual errors for 0.2mm alignment accuracy.
Multi-Device Compatibility
Works with GPUs, smartphones, consoles—supports chips from 5×5mm to 50×50mm. Dual nozzles handle lead-free solder (Sn96.5/Ag3/Cu0.5) and traditional alloys.
One-Click Presets for Efficiency
Pre-programmed profiles for PS5/Xbox motherboards, iPhone BGA chips. Saves 70% setup time vs manual stations. Includes vacuum pickup tool for safe IC extraction.
Pro-Grade Safety Features
EMI-shielded cables + auto-cooling fans prevent overheating. CE/FCC certified. Ideal for repair shops, electronics labs, and manufacturing lines.
Bulk Order Advantage
Direct factory pricing with 24hr QC-checked shipping. Custom voltage options (110V/220V) available for global warehouses.