LY IR8500 Infrared BGA Rework Soldering Station

Precision-engineered infrared heating system ensures uniform temperature distribution for flawless BGA rework. High-quality ceramic heating elements with rapid thermal response minimize component stress during reballing.

Industrial-grade stainless steel chassis with reinforced cooling vents enhances durability for continuous operation. Integrated thermal imaging technology allows real-time monitoring for accurate temperature control.

Ideal for professional-level laptop motherboard repairs, mobile phone PCB reballing, and advanced SMD component soldering. Compatible with 220V power supply for global workshop use.

Ultra-sensitive digital controls with auto-calibration ensure repeatable results across multiple repair cycles. Includes optimized reflector design for focused heat application without damaging surrounding components.

Complete rework solution featuring adjustable IR emitter arrays for versatile chip size handling. Meets ESD protection standards for safe handling of sensitive electronics.

Direct wholesale pricing with bulk order discounts available for repair shops and production facilities. Worldwide shipping with guaranteed lowest market price.