Precision-Grade Chip Glue Removal Fixture
Dual-bearing clamp design ensures ultra-smooth rotation for delicate IC/CPU handling. High-tensile aluminum alloy construction resists deformation under heat. Non-slip silicone pads protect motherboard surfaces during soldering.
Professional-Grade Stability
Machined steel pivot points eliminate wobble during precision desoldering. Weighted base prevents tipping with one-handed operation. Compatible with 98% Android phone motherboard sizes.
Workflow Efficiency Optimized
360° free-stop rotation enables multi-angle chip access. Spring-loaded pressure control prevents PCB damage. Essential for BGA rework, chip replacement, and factory-level repairs.
Industrial Durability
Hardened alloy jaws withstand 500°C continuous heat exposure. Laser-etched measurement scales for component alignment. Includes anti-static coating for sensitive electronics.
Cross-Professional Utility
Ideal for microsoldering stations, repair shops, and electronics assembly lines. Doubles as SMD component holder for watchmakers and drone builders. Ships pre-lubricated for immediate workshop integration.