RL-601T 18-in-1 Motherboard Middle Layer Board with Plant Tin Platform

Premium tin-plated steel construction ensures superior heat resistance and durability for repeated reballing cycles. Precision laser-cut stencil design guarantees flawless solder ball alignment for iPhone X through 14 Pro Max models.

Integrated plant tin platform provides stable heating surface for BGA chips, reducing warping risks during repairs. Includes 18 essential stencils covering common ICs like baseband, CPU, and power management chips.

Ideal for professional repair shops tackling water damage, chip replacement, or motherboard refurbishment. Compatible with most rework stations and soldering irons for seamless workflow integration.

Engineered with 0.15mm thickness for optimal solder paste application without bleeding. Each stencil features etched size markings for quick component identification during high-volume repairs.