QUICK 861PRO Smart Hot Air Desoldering Station

Precision Engineering
– High-performance ceramic heating element ensures rapid heat-up (5 sec) and uniform airflow for delicate PCB repairs.
Advanced Control
– Digital PID temperature regulation (±1°C accuracy) with adjustable airflow (120L/min max) prevents component damage during IC or SMD rework.
Durable Build
– Industrial-grade metal housing with silicone-insulated nozzles (5 sizes included) withstands prolonged use at 480°C max temperature.
Smart Safety
– Auto-cooling fan, overheat protection, and ESD-safe design ensure safe operation on mobile phone motherboards or automotive electronics.
Multi-Scenario Use
– Ideal for BGA reballing, chip-level repairs, and lead-free solder work in workshops or manufacturing facilities.
Global Warranty & Bulk Discounts
– Direct factory pricing with volume deals for professional repair shops and distributors.