Professional BGA Rework Station DH-5880 – Precision & Efficiency for Advanced Repairs

High-Temperature Stability
– Industrial-grade heating elements ensure uniform heat distribution, preventing PCB warping during BGA rework. Ideal for intricate motherboard and GPU repairs.
Smart Airflow Control
– Adjustable hot air nozzle with precise airflow calibration (50-120L/min) for safe IC chip removal without damaging surrounding components.
Rapid Heat-Up
– Advanced ceramic heating tech reaches 480°C in under 60 seconds, boosting efficiency for high-volume repair workshops.
Multi-Layer PCB Compatibility
– Supports thick boards (up to 10 layers) with dual-zone temperature control (preheat + reflow) for flawless solder reballing.
Ergonomic Design
– Lightweight alloy body with anti-slip grips and quick-swap nozzles (4mm–12mm) for prolonged comfortable use.
Wide Application
– Perfect for smartphones, laptops, gaming consoles, and automotive ECU repairs. Trusted by professional technicians for reliable, repeatable results.
Global Wholesale Advantage
– Factory-direct pricing, bulk discounts, and fast shipping—no middlemen, just unbeatable value.