Precision Magnetic Reballing Mat for iPhone A8-A16 Motherboards

High-strength magnetic base ensures secure BGA stencil alignment during reballing, eliminating slippage for flawless solder ball placement.

Premium Anti-Slip Silicone Surface

Micro-textured silicone coating provides superior grip for motherboards, preventing scratches while resisting high temperatures up to 300°C during reflow processes.

Multi-Generational Compatibility

Engineered to fit iPhone A8 through A16 chipsets with precisely laser-etched alignment markers for accurate tin planting across all BGA configurations.

Industrial-Grade Aluminum Alloy Frame

CNC-machined 6061 aluminum platform offers lightweight durability with reinforced corners to withstand daily workshop use without warping.

Optimized Workspace Efficiency

Integrated solder ball containment channels and flux-resistant surface streamline reballing workflow for repair shops and microsoldering professionals.

Tool-Free Stencil Replacement

Patented quick-release design allows instant stencil swaps without disassembling the magnetic base, saving 70% setup time between jobs.