Precision-engineered with high-quality infrared laser technology for pinpoint accuracy in desoldering and repairing delicate mobile phone motherboards. Features rapid short-circuit detection and seamless component disassembly, ensuring minimal heat damage to surrounding circuits.

Constructed with durable heat-resistant materials and advanced cooling systems for prolonged operation without overheating. Ideal for professional technicians handling intricate PCB repairs and micro-soldering tasks in electronics workshops.

Compact yet powerful design enables efficient workspace utilization, while adjustable power settings cater to various motherboard types. Delivers industry-leading performance for diagnosing faults, removing BGA chips, and repairing solder bridges with surgical precision.

Optimized for high-volume repair operations with reliable repeatability, making it perfect for mobile service centers and electronics manufacturing facilities. Backed by robust safety features including automatic shutoff and real-time temperature monitoring.

Significantly reduces repair time compared to traditional methods while maintaining exceptional component integrity. Trusted solution for tackling modern smartphone board-level issues from water damage to chip replacement.