High-performance Vespel SP-1 Polyimide for Semiconductor Pin Components

Ultra-pure polyimide material ensures exceptional thermal stability (up to 300°C continuous use) and minimal outgassing, critical for vacuum environments in semiconductor manufacturing. Precision-machined components exhibit near-zero particulate contamination, ideal for wafer handling and probe card applications.

Superior dielectric strength (110 kV/mm) and radiation resistance prolong service life in high-voltage IC testing equipment. Low coefficient of friction (0.2-0.3) prevents particle generation during repeated insertions in test socket assemblies.

FDA-compliant formulation meets cleanroom standards for MEMS fabrication and aerospace sensor production. Customizable tolerances to ±0.001" for critical alignment in photolithography tooling. Bulk packaging available for high-volume semiconductor OEMs with certified traceability documentation.