LWS-301 No Wind Intelligent Laser Desoldering Station delivers precision and efficiency for delicate electronics repair. Its advanced laser technology eliminates airflow interference, ensuring safe removal of mobile phone IC chips and BGA components without damaging surrounding circuits.

The station features a high-precision temperature control system with real-time monitoring, allowing optimal heat application for CPU degumming and motherboard rework. Its ergonomic design includes an anti-static ceramic nozzle and reinforced steel body for durability in professional workshops.

Ideal for micro-soldering tasks on smartphones, tablets, and embedded systems, this tool reduces rework time by 40% compared to traditional hot air stations. The intelligent auto-shutoff function prevents overheating, extending component lifespan.

Engineered for repair centers and PCB manufacturers, it supports lead-free solder alloys and complies with ESD safety standards. The compact footprint saves bench space while maintaining industrial-grade performance.