NEW Puhui T-890i BGA Rework Station

Precision Heating System
Equipped with advanced infrared heating technology for uniform temperature distribution, ensuring safe and efficient IC reballing without damaging sensitive components.
Durable Industrial-Grade Construction
High-quality stainless steel frame with heat-resistant ceramic nozzles, designed for long-term reliability in intensive motherboard repair workflows.
Smart Temperature Control
Digital PID controller allows exact temperature adjustments (100°C–500°C) with ±1°C accuracy, ideal for delicate laptop and desktop motherboard repairs.
Multi-Size Compatibility
Adjustable nozzle sizes (10mm–50mm) accommodate various chip dimensions, from small SMD components to large BGA chips.
Efficient Workflow Design
Integrated vacuum suction and hot air gun streamline rework processes, reducing downtime in professional repair shops or electronics manufacturing.
Global Wholesale Advantage
Direct factory pricing ensures unbeatable value for bulk buyers, with guaranteed lowest rates worldwide.