High-Precision Dicing Frame for Semiconductor Industry
Ultra-durable SUS420J stainless steel construction ensures long-term performance in harsh environments. Precision-machined 6-inch silicon wafer iron ring meets JIS standards for flawless compatibility.
Engineered for Semiconductor Manufacturing
Ideal for wafer dicing, die bonding, and laser cutting processes. Corrosion-resistant surface treatment extends lifespan under high-temperature conditions.
Industrial-Grade Reliability
Mirror-polished inner edge prevents wafer contamination. Reinforced hoop design maintains structural integrity during high-speed dicing.
Global Supply Chain Advantage
Direct factory pricing with bulk order discounts. ISO-certified production guarantees batch-to-batch consistency for industrial buyers.
End-to-End Production Solution
Seamlessly integrates with automatic wafer handling systems. Essential for cleanroom environments in MEMS, LED, and IC packaging applications.