High-Performance DaJin 6-Inch Wafer Iron Ring Dicing Frame with Hoop
Precision-engineered for semiconductor dicing, this wafer iron ring frame ensures ultra-stable wafer handling during high-speed cutting. The reinforced iron alloy construction offers exceptional durability and heat resistance, minimizing warping under extreme conditions. Designed with a secure hoop mechanism, it prevents wafer slippage and maintains consistent alignment for flawless dicing accuracy. The corrosion-resistant surface treatment extends lifespan even in harsh industrial environments. Ideal for semiconductor manufacturing, MEMS production, and advanced electronics fabrication. Compatible with automated dicing saws, streamlining mass production workflows. Bulk pricing available—optimize your supply chain with our unbeatable wholesale rates. Trusted by global manufacturers for reliability and cost efficiency.