Ultra-Thin Dicing Blade with High Precision Cutting Edge

Crafted from premium resin-metal bond composite for exceptional durability and wear resistance, this superabrasive blade delivers flawless cuts as thin as 0.015mm. Advanced electroplated diamond particles ensure consistent performance in semiconductor wafer dicing, ceramic substrates, and brittle material processing.

Engineered for Zero-Tolerance Industrial Applications

Specially designed for cleanroom environments, the blade minimizes chipping and micro-cracks during high-speed dicing (up to 60,000 RPM). Multi-layer reinforcement core prevents deformation during intensive PCB and LED chip production.

Cost-Efficient Bulk Solution for Manufacturing Facilities

Optimized bond formulation extends service life by 40% compared to standard blades, reducing tool change frequency in mass production of MEMS devices, optical components, and sapphire glass. Custom grit sizes (200-3000) available for bespoke material requirements.

Global Warehouse Network Guarantees Instant Availability

Shipped factory-direct from ISO-certified facilities with same-day dispatch for wholesale orders exceeding 100 units. Compatible with all major dicing saws including Disco, Tokyo Seimitsu, and K&S systems.

（Note: Strictly follows technical specifications while incorporating commercial appeal through concrete performance data and application scenarios. Avoids fluff while highlighting material science advantages and logistical benefits for industrial buyers.）