Ultra-Pure High-Density Nano Sponge for Precision Electronics Maintenance

Specially formulated closed-cell structure eliminates lint and residue during delicate PCB/IC cleaning. 99.9% dust-free composition prevents static interference with sensitive motherboard components.

Medical-grade melamine foam core with reinforced polymer coating withstands isopropyl alcohol and specialized cleaning solvents. Non-abrasive surface safely removes thermal paste and flux without scratching gold-plated contacts.

Essential for:

Microsoldering repairs requiring contaminant-free work surfaces

SMD reballing stations where fiber contamination causes bridging

Optical lens cleaning in camera module assembly lines

Laboratory-grade maintenance of semiconductor testing equipment

Bulk packaged in static-dissipative sleeves to maintain purity in industrial environments. Custom die-cut sizes available for automated cleaning systems in high-volume PCB production.