BGA Rework Station WDS-520 – Precision Mobile IC Reballing with Laser Positioning

High-Precision Laser Alignment
– Equipped with advanced laser positioning for pinpoint accuracy in IC reballing, ensuring flawless BGA chip placement and alignment.
Durable Industrial-Grade Construction
– Heavy-duty steel frame with heat-resistant components for long-lasting performance under continuous high-temperature operation.
Smart Temperature Control
– Digital PID temperature regulation (up to 500°C) ensures consistent heating for error-free solder reflow and rework.
Versatile Application
– Ideal for repairing smartphones, laptops, game consoles, and other PCB assemblies requiring BGA reballing or rework.
Portable & User-Friendly
– Compact design with adjustable airflow nozzles and ergonomic controls for efficient bench-top operation in repair shops or labs.
Complete Reballing Kit
– Includes high-quality stencils, solder paste, and tools for a professional-grade rework setup right out of the box.