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bga rework station WDS-520 mobile ic reballing machine with laser position light
$2560$3718.86-31.16%
Model Number:
WDS-520 bga reballing machine
Quantity:
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Features
BGA Rework Station WDS-520 – Precision Mobile IC Reballing with Laser Positioning
High-Precision Laser Alignment
– Equipped with advanced laser positioning for pinpoint accuracy in IC reballing, ensuring flawless BGA chip placement and alignment.
Durable Industrial-Grade Construction
– Heavy-duty steel frame with heat-resistant components for long-lasting performance under continuous high-temperature operation.
Smart Temperature Control
– Digital PID temperature regulation (up to 500°C) ensures consistent heating for error-free solder reflow and rework.
Versatile Application
– Ideal for repairing smartphones, laptops, game consoles, and other PCB assemblies requiring BGA reballing or rework.
Portable & User-Friendly
– Compact design with adjustable airflow nozzles and ergonomic controls for efficient bench-top operation in repair shops or labs.
Complete Reballing Kit
– Includes high-quality stencils, solder paste, and tools for a professional-grade rework setup right out of the box.
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