Professional-Grade Laser BGA Rework Machine for Precision Repairs

Ultra-Precise Laser Technology

Equipped with advanced laser soldering for pinpoint accuracy on micro components, ensuring flawless BGA reballing and rework without damaging delicate phone or laptop motherboards.

Semi-Automatic Efficiency

Streamlines complex repairs with semi-auto functions, reducing manual errors and speeding up processing time for high-volume repair shops.

Multi-Device Compatibility

Optimized for both smartphones and laptop motherboards, supporting a wide range of PCB sizes and chip types with adjustable power settings.

Durable Industrial Build

Constructed with high-grade aluminum alloy frame and heat-resistant components, ensuring long-term stability even under continuous operation.

User-Friendly Interface

Features intuitive touchscreen controls and pre-set programs for common repair scenarios, minimizing the learning curve for technicians.

Ideal for Repair Businesses

Perfect for electronics repair shops, warranty service centers, and IT departments needing reliable, high-precision equipment for daily motherboard-level repairs.

Global Wholesale Advantage

Direct factory pricing with bulk order discounts, backed by worldwide logistics support for fast delivery. No middlemen, no inflated costs.