High-Quality Porous Vacuum Ceramic Chuck Table for Accretech Disco Dicing Machine
Precision-engineered for semiconductor wafer dicing, this ceramic chuck table ensures ultra-stable vacuum adhesion with uniform porous surface technology. Made from high-grade alumina ceramic for exceptional thermal resistance and minimal particle contamination, ideal for high-speed dicing applications. Optimized for Accretech Disco machines, it delivers flawless flatness (±0.001mm) and durability under continuous operation. The micro-porous structure enhances suction efficiency while preventing wafer slippage. Perfect for advanced MEMS, LED, and IC packaging production lines. Direct factory pricing ensures unbeatable value for bulk orders. Trusted by global semiconductor manufacturers for reliability and performance. Upgrade your precision cutting process with industry-leading quality.