Premium Resin Bond Dicing Blade – Precision Cutting for Wafer & Glass
Ultra-thin diamond grit layer ensures smooth, chip-free cuts with exceptional edge retention. High-grade resin bond matrix reduces heat buildup, prolonging blade lifespan. Engineered for hard materials: ideal for silicon wafers, optical glass, ceramics, and brittle composites. Compatible with most dicing saws for microelectronics and semiconductor applications. Industrial-grade precision: uniform particle distribution minimizes material waste. Customizable grit sizes (100-3000) available for fine polishing or rapid rough cuts. Bulk discount available. Global shipping with guaranteed lowest wholesale prices. MOQ-friendly for manufacturers and labs.