TBK F001 3-in-1 Mobile Phone Repair Tool – Ultimate Precision & Efficiency
High-performance aluminum alloy construction ensures durability and heat dissipation. Integrated UV curing, smoke exhaust, and cooling functions for seamless motherboard repairs. Precision-engineered nozzle design delivers focused airflow for delicate component handling. Ultra-quiet dual-fan system maintains optimal temperature during prolonged use. Adjustable airflow control for versatile applications: soldering, adhesive curing, or heat management. Ideal for professional repair shops, DIY enthusiasts, and electronics manufacturing. Compact, lightweight design with non-slip base for stable workstation integration. Compatible with most smartphones, tablets, and small PCB assemblies. Engineered for speed – reduces repair time by 30% with rapid UV curing and cooling.