Professional-Grade Android Chip Planting Stencil Set for Precision Repairs
High-precision steel stencil designed for BGA chip planting and reballing, ensuring flawless alignment during mobile phone PCB repairs. Made from durable tin-plated steel for superior solder paste application and long-lasting performance. Ideal for repairing Android devices, including popular models requiring precise chip placement. Features laser-cut apertures for consistent solder ball sizing and smooth surface finish to prevent paste sticking. Essential for professional repair shops and technicians, this stencil set enhances efficiency in micro-soldering tasks. Compatible with various BGA chips, offering versatility in smartphone, tablet, and motherboard repairs. Engineered for high repeatability and minimal template wear, ensuring reliable performance even under frequent use. Compact and easy to store, perfect for workshops with limited space. Global wholesale pricing available—stock up on premium repair tools at unbeatable rates. Bulk orders welcome for businesses seeking cost-effective, high-quality solutions.