Precision Optical Alignment
– High-definition optical system ensures pinpoint accuracy for BGA rework and SMD soldering, critical for delicate iPhone and Samsung CPU repairs.
Advanced Temperature Control
– Multi-zone heating with PID technology prevents thermal damage, ideal for high-density PCB components and sensitive IC chips.
Industrial-Grade Build
– Heavy-duty steel frame with ceramic heating elements ensures durability and consistent performance in professional repair workshops.
Versatile Repair Solution
– Supports BGA reballing, SMT rework, and micro-soldering, perfect for smartphones, laptops, and gaming consoles.
Ergonomic & Efficient
– Adjustable nozzle and quick-change tooling streamline workflow, reducing downtime in high-volume repair operations.
Global Stock Availability
– Direct wholesale pricing with bulk discounts, ensuring fast delivery for repair businesses and tech hubs worldwide.