Precision-Crafted Mobile Repair Tool
Ultra-thin hand-polished stainless steel blade for precise glue removal and chip prying without damaging delicate components.
Professional-Grade BGA & IC Chip Handling
Specially designed edge angle ensures safe lifting of BGA chips and CPU components during mobile phone repairs.
Ergonomic Anti-Slip Grip
Textured rubberized handle provides maximum control during intricate PCB maintenance tasks.
Multi-Surface Application
Effective on adhesive layers, solder masks, and underfill materials in smartphone, tablet, and microelectronics repair.
Industrial-Grade Durability
Tempered steel construction maintains sharpness through 500+ repair cycles with corrosion-resistant properties.
Micro-Incision Capability
0.2mm blade thickness accesses tight spaces between IC chips and circuit boards with surgical precision.
Global Wholesale Advantage
Factory-direct pricing with bulk order discounts for repair shops and electronics maintenance centers.
Universal Compatibility
Essential tool for iPhone, Samsung, Huawei motherboard repairs and surface-mount device rework.