Disco Dicing Ring for Semiconductor Equipment

High-precision alumina ceramic construction ensures superior durability and thermal stability for rigorous semiconductor processing.

Mirror-polished surface minimizes particle contamination, critical for maintaining ultra-clean wafer environments during dicing.

Optimized groove design enhances coolant flow efficiency, extending blade life and improving cut accuracy in high-speed dicing applications.

Compatible with major Disco dicing saw models (DFD6000/8000 series), ensuring seamless integration into existing production lines.

Essential for semiconductor fabrication, LED manufacturing, and MEMS production where micron-level precision is required.

Bulk order discounts available for OEMs and foundries with volume procurement needs.