Professional-Grade BGA Rework Station for Precision Soldering
High-precision infrared heating with 16-zone temperature control ensures uniform heat distribution for flawless BGA chip rework. Industrial-grade ceramic heating elements deliver rapid thermal response, minimizing component stress during reflow. Dual-lens alignment system with 4K optical zoom provides ultra-clear real-time imaging for accurate chip placement. Steel-reinforced aluminum alloy frame offers durability for heavy-duty workshop use. Ideal for PCB repair, smartphone motherboard rework, and gaming console chip replacement. Compatible with lead-free solder processes, meeting global environmental standards. Complete kit includes vacuum pickup tool, flux dispenser, and anti-static tweezers for full workstation readiness. Built-in error detection prevents overheating damage to sensitive electronics. Plug-and-play operation with multilingual interface simplifies complex rework tasks. Trusted by electronics manufacturers and repair centers worldwide for mission-critical component servicing.