High-Precision BGA Reballing Stencil for iPhone 14 Series
Crafted from premium stainless steel for superior durability and heat resistance, this stencil ensures flawless solder ball placement during BGA rework. Laser-cut with micro-precision to match A16/A15 CPU and SSD IC layouts, guaranteeing perfect alignment for iPhone 14/Pro/Max middle-layer motherboard repairs. Ideal for professional repair technicians tackling complex motherboard-level fixes, this tool streamlines reballing with its ultra-thin design and anti-warping construction. The reusable steel mesh maintains consistent performance even under high-temperature soldering. Optimized for bulk repair workshops and microsoldering specialists, this stencil reduces rework errors while maximizing efficiency. Compatible with lead-free and leaded solder alloys, it’s a must-have for high-volume iPhone refurbishment operations. Global wholesale pricing ensures unbeatable value for large-quantity orders. Stock up for your repair business with the most cost-effective BGA solution on the market.