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1***m

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me llego antes de lo esperado
Jan.20.2025

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Jan.20.2025
1***m

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I really love OKWISHING. Their products are great and shipping is always on point. I have absolutely nothing negative to say abt OKWISHING!!!
Feb.21.2025

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Feb.21.2025
1***m

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I love my order and it came in a timely manner. It looks just like the picture and feels soft and flattering.
Feb.28.2025

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Feb.28.2025
- 1
BGA Reballing Stencil IP14 is applicable to Apple iPhone 14/P/Pro/Max Middle Layer Motherboard A16/15 CPU SSD IC steel tin mesh
$5.6$8.5-34.12%
Tool type:
14 series motherboard pcb repair
Quantity:
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Features
High-Precision BGA Reballing Stencil for iPhone 14 Series
Crafted from premium stainless steel for superior durability and heat resistance, this stencil ensures flawless solder ball placement during BGA rework. Laser-cut with micro-precision to match A16/A15 CPU and SSD IC layouts, guaranteeing perfect alignment for iPhone 14/Pro/Max middle-layer motherboard repairs. Ideal for professional repair technicians tackling complex motherboard-level fixes, this tool streamlines reballing with its ultra-thin design and anti-warping construction. The reusable steel mesh maintains consistent performance even under high-temperature soldering. Optimized for bulk repair workshops and microsoldering specialists, this stencil reduces rework errors while maximizing efficiency. Compatible with lead-free and leaded solder alloys, it’s a must-have for high-volume iPhone refurbishment operations. Global wholesale pricing ensures unbeatable value for large-quantity orders. Stock up for your repair business with the most cost-effective BGA solution on the market.
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