High-Precision 5-in-1 BGA Chip Removal Tool

Professional-grade stainless steel blade ensures scratch-free prying for delicate motherboard components. Multi-functional design combines chip lifting, glue scraping, and surface cleaning in one ergonomic tool.

Industrial-Grade Heat Resistance

Hardened steel construction withstands repeated exposure to soldering temperatures up to 450°C without warping. Mirror-polished edge maintains sharpness through 10,000+ PCB repair cycles.

Non-Conductive Safety Engineering

Ceramic-coated tip prevents accidental short circuits during live board diagnostics. Angulated 35° edge profile optimizes for both vertical chip extraction and horizontal adhesive removal.

Dual-Surface Application Mastery

Concave side handles BGA/CSP package removal while convex edge tackles stubborn thermal paste. Micro-serrated grip zone ensures control during precision SMD rework.

Cross-Industry Repair Solution

Essential for electronics refurbishment labs, smartphone microsoldering stations, and gaming console repair specialists. Compatible with all mainstream motherboard layouts including Apple Logic Boards and NVIDIA GPU chipsets.