3D Mobile Phone Motherboard Inspection Repair PCB Troubleshoot Tools Thermal Infrared Imager Camera

Precision PCB Diagnostics
– High-resolution thermal imaging detects microscopic heat variations for pinpointing short circuits, faulty components, and power leaks with sub-millimeter accuracy.
Dual-Lens 3D Scanning
– Combines infrared and optical lenses to overlay real-time thermal data on a 3D visual model, revealing hidden defects under chips or layered PCB traces.
Industrial-Grade Sensor
– Features a 256x192 IR array with ±2°C thermal sensitivity, capturing heat signatures from -20°C to 550°C for comprehensive motherboard analysis.
Multi-Layer Troubleshooting
– Identifies issues in BGA chips, capacitors, and voltage regulators by analyzing thermal dissipation patterns, reducing guesswork in microsoldering repairs.
Ergonomic Design
– Lightweight magnesium alloy housing with anti-slip grips and a rotatable 2.4" LCD screen for angled inspections in tight spaces.
Cross-Industry Versatility
– Ideal for smartphone repair shops, electronics recycling facilities, and industrial PCB maintenance teams handling bulk diagnostics.
Instant Data Export
– Save thermal images/videos via USB-C for client reports or team collaboration, compatible with Windows/macOS analysis software.
Batch Repair Efficiency
– Enables rapid screening of multiple devices in wholesale repair operations, cutting diagnostic time by 70% compared to multimeter testing.
Plug-and-Play Setup
– No calibration needed; includes rechargeable battery (8h runtime) and magnetic macro lenses for close-up IC inspections.