Precision-Crafted LV-05 BGA Repair Machine for Professional-Grade Phone Motherboard Rework
Ultra-durable aerospace-grade aluminum alloy frame ensures stability during high-temperature reflow, minimizing heat distortion for flawless BGA soldering. Advanced IR preheating with 16-zone temperature control (50°C–450°C ±2°C) prevents PCB warping, ideal for iPhone/Xiaomi/Samsung chip-level repairs. Patented vacuum suction plate secures motherboards up to 12×12 inches, compatible with 5G modem and foldable phone flex PCB rework. Smart auto-calibration laser aligns BGA chips within 0.01mm precision – essential for repairing GPU/CPU solder balls in gaming phones. Industrial-grade quartz heating tube delivers instant 800W heating, 30% faster than ceramic elements for high-volume repair shop efficiency. Modular nozzle system (8 sizes included) handles micro-BGA packages down to 0.3mm pitch, perfect for MacBook logic boards and Android USB port replacements. OLED touchscreen with 20 preset profiles for common chips (A15/Snapdragon/Dimensity) – one-touch operation reduces technician training time. ESD-safe work surface (10^6–10^9Ω) protects sensitive components during automotive infotainment system repairs. Includes German-made K-type thermocouple for real-time solder joint monitoring, critical for restoring water-damaged devices. Backed by global wholesale pricing – bulk orders (10+ units) include free maintenance toolkit and VIP technical support.