Premium BGA Reballing Stencils for iPhone 5S to 8X

High-precision laser-cut stainless steel stencils ensure flawless solder ball placement during IC rework. Compatible with multiple iPhone models including 5S/6/6P/6S/6SP/7/7P/8/8X for versatile repair applications.

Durable anodized aluminum frame prevents warping under high temperatures, guaranteeing long-term reliability. Ideal for professional microsoldering technicians and electronics repair workshops.

Full kit includes essential reballing templates with optimized aperture design for consistent solder volume control. Streamlines BGA chip replacement and refurbishment processes with unmatched accuracy.

Exclusive bulk pricing available for repair shops and wholesale buyers. Globally sourced components meet industry-leading quality standards at unbeatable wholesale rates.