Precision BGA Rework Station with Advanced SMD Technology

Industrial-grade quartz infrared heating system ensures even heat distribution for flawless BGA chip removal/replacement. Dual-zone temperature control (50-500°C) with ±2°C accuracy prevents PCB warping.

High-magnification 4K optical alignment system features coaxial lighting for 0.01mm placement precision. Includes vacuum pickup tools for 0.2-50mm component handling.

Multi-layer steel construction with ceramic-insulated nozzles withstands 800+ rework cycles. Compatible with QFN/LGA/CSP packages (5×5mm to 45×45mm).

Ideal for smartphone motherboard repair, automotive ECU reworking, and industrial automation equipment maintenance. UL-certified power supply with auto-cooling function.

Complete kit includes lead-free solder paste dispenser, 15 nozzle set, and anti-static tweezers. OEM/ODM customization available for bulk orders.